Herff senior Madison Cole receives $2,500 scholarship from Smith + Nephew
August 19, 2026
Herff College of Engineering senior Madison Cole received a $2,500 scholarship from Smith + Nephew, money she says will help her complete her goals as she enters her final undergraduate academic year in Herff's Department of Mechanical Engineering.
"This scholarship gives me the stability to fully focus on my goals at the Herff College of Engineering. Financial stress has often forced me to choose only what was essential and set aside opportunities I wanted to pursue. With this support, I can concentrate on my coursework, prepare for the FE exam, and continue building the foundation I need for graduate study in manufacturing. It reassures me that I’m on the right path and that others believe in my potential as an engineer," Cole said.
Along with the financial aid, Smith + Nephew celebrated Cole, along with other scholarship recipients, in an internal company announcement.
Cole said the company's belief in her is just as valuable as the financial aid.
"This investment from Smith & Nephew means more to me than financial assistance. It feels like a genuine vote of confidence in my future. Their mission to restore mobility and improve quality of life has always stood out to me, and knowing that a company dedicated to such meaningful work sees value in my journey is incredibly motivating. It reminds me that engineering is not just about technical concepts; it is about creating solutions that help people live fuller and stronger lives. This support encourages me to keep pushing forward, to keep learning, and to work toward a career where I can contribute to that same kind of impact," Cole said.