What is a Wire Bonder?

Wire BonderA wire bonder attaches a length of small diameter soft metal (Au, Cu, Ag, or Al) wire into a compatible metallic surface without the use of solder. This instrument is widely used to make interconnections between the different components of an integrated circuit or other semiconductor devices.

Major Features and Specifications of the Hybond 522A

  • Thermosonic ball bonder for wires from 0.7 mil to 2.0 mil
  • Bondable wire material: gold
  • Bond force range L 15 to 150 g
  • Ultrasonic system: 62.5 kHz
  • Horizontal reach of 3.5 in. (8,89cm)
  • 0.5 inch and 2 inch spool mounts standard
  • Loop height control adjustment
  • 1-2-2 stitch capability standard
  • Swing away clamps for easier wire threading
  • Electronic ball size control
  • Audio and visual bond fault indicators
  • Independent 1st and 2nd bond controls
  • Motorized vertical wire feed
  • 6 x 8.5 in.(15,24 x 21,59cm) X-Y work platform
  • LED display for monitoring temperature
  • Independent lever for Z bond head control
  • Infinite angle mounting for microscope
  • Tail length is adjustable by a front panel control

Users interested in using the Materials Science Lab or equipment should contact: